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| Mfg Part Number: 93L422 | NSN : 5962-01-314-9189 | NIIN : 013149189 |
| CAGE Code : 55009 | Manufacturer: Stellar Microelectronics Inc | Item Name : Microcircuit Memory |
| FSC : 5962 Microcircuits Electronic |
We at Integrated Purchasing are here to help you secure top quality Microcircuit Memory parts like 93L422. This particular NSN component is listed alongside the part number 93L422, having been manufactured by Stellar Microelectronics Inc. Reach out by filling out an RFQ for a timely quote and please let us know your desired quantity, price, and shipping time frame so we can make the purchasing process as efficient as possible to meet your specific needs. We have experts working around-the-clock and guarantee a response to your completed form within 15 minutes.
In addition to NSN 5962-01-314-9189, we offer a vast inventory of parts at competitive pricing. We understand the importance of fully informed purchasing and therefore list every item with all applicable information. For example, you can find NSN 5962-01-314-9189 and part number 93L422 which are manufactured by Stellar Microelectronics Inc under the CAGE Code 55009. Let us provide you with any information you require in a timely and detailed manner. We have experts working around-the-clock to answer any questions in addition to quotes. Do not hesitate to contact us and allow Integrated Purchasing to do the work for your sourcing, logistics, shipments, and quality so that you can focus on building. Call or email us today to get started!
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-314-9189 Item Description: Microcircuit Memory | 5962 | 013149189 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 93l422 | 2 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 495.0 MILLIWATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
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